GlobeNewswire Inc | Nov 9, 2021 12:28PM EST

November 09, 2021

SAN JOSE, Calif., Nov. 09, 2021 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ:AVGO) today announced its continued commitment to open computing at the2021 Open Compute Project (OCP) Global Summit, being held November 9-10 at the San Jose Convention Center. A long-time supporter of open, standards-based technologies, Broadcom is dedicated to developing high-performance, scalable solutions optimized for AI/ML in Cloud and hyperscale data centers.

Our innovative and broad portfolio focused on connectivity, as well as our significant investment going into this space, clearly demonstrates Broadcom is passionately committed to OCP and open standards, said Charlie Kawwas, Ph. D., chief operating officer, Broadcom. Our leading-edge technologies, such as the industrys highest bandwidth switch and routing chip, OCP NIC 3.0 adapters, OCP 3.0 storage adapters, PCIe switching, line card PHYs, and optical module PHYs will benefit data centers, service providers, and enterprise alike, and enable this vibrant OCP community.

Broadcom is a leading technology provider of OCP compliant solutions bothdirectly through designproject contributions and indirectly via ODM and OEM partnerships that integrate its technologies into their systems. Broadcoms innovative products are designed specifically to deliver a rich set of features at maximum performance, while providing power and cost efficiencies.

Broadcom Ethernet switch and routing chips, PCIe switches, Ethernet network adapters, PAM4 Line card PHYs, and SAS/SATA/NVMe storage solutions are featured in a broad range of OCP designs at this years summit. Notable OCP demonstrations and initiatives involving Broadcoms technologies include:

-- Ampere is showing a demo of the Broadcom2x100G OCP NIC 3.0 adapter as part of their Ampere Altra and Ampere Altra Max CPU platforms, Expo Hall, Booth B13. -- Arrcus is showcasing two demos at OCP based on UfiSpace hardware. The first demo is for a massively scalable, virtualized, distributed routing platform utilizing Broadcom Jericho2 and Ramon chipsets, OCP Experience Center. The second demo will showcase the Ethernet VPN multi-homing feature (Arrcus Open MLAG) on TD4 platforms, using dual TORs based on TD4-X11, Arrcus Booth C4. -- Broadcom showcasing 2x100G OCP NIC 3.0 adapter with multi-host connectivity, manageability, and precision timing using PTP, OCP Experience Center. -- Broadcom featuringthe9502-16i HBA and 9562-16i RAID OCP 3.0 SFF Storage Adapters, OCP Experience Center. -- Capgemini engineering will be at OCP, based on the Virtual Broadband demo they did at BBWF 2021, Amsterdam this past October 12. The demo was designed around the Broadcom Qumran2C housed in UFISpace Q2C white boxes. -- Edgecore Networks will be showcasing switch systems, featuring Broadcom Trident 3, Qumran 2a, Qumran-AX, Trident 4, Jericho 2 and Qumran 2c silicon, Edgecore Networks Booth C23. -- Meta and Broadcom demo featuring Transparent Clock based time synchronization driven by Tomahawk 4 switching silicon. Arista 7060DX5 and 7388X5 Tomahawk 4 based switches also showcased, OCP Experience Center.

-- Meta and Broadcom demo, showcasing our 2x100G OCP NIC 3.0 adapter, featuring Broadcoms device attestation security feature with OpenBMC using SPDM 1.1, OCP Experience Center. -- MiTAC will showcase three 5G Edge compute products including Aowanda, Firestone / Whitestone, and Capri incorporating Broadcom dual-port and quad-port 25G, 50G, and 100G Ethernet OCP NIC 3.0s and standard PCIe NICs, Expo Hall Booth C25. -- Pluribus Networks and Broadcom collaborating to showcase the Adaptive Cloud Fabric solution with newly added Kubernetes-aware visibility and analytics, leveraging open data center switches featuring Trident 3 and Trident 4 hardware-accelerated telemetry, Pluribus Booth, A26. Presentation Tuesday, November 9, 3:00p.m., 210C. -- QCT will showcase a demo of S5X, S5XQ, S5XQ All-Flash appliances incorporating Broadcom OCP NIC 3.0 adapter, SAS95xx MegaRAID Storage Controller, and an 88xxx PCIe Gen 4 Switch, Expo Hall Booth A33.

-- Viking Enterprise Solutions will be showing a demo of the Broadcom 2x100G OCP NIC 3.0 adapter in theirVSS1240PNVMe Storage Server platform, OCP Experience Center. -- Wiwynn is showcasing several systems including OCP Server and Storage (SV7100G4/SV7000G4/ST7000G4), OAI Server (SV600G4), Generic Servers (SV328R) and Edge Server (EP100/ES200), which use several Broadcom products including: Gen4 PCIe Switch (PEX88xxxx), SAS96xx Storage Controllers, 24G SAS Expanders (SAS4xXX) and several OCP NIC 3.0 adapters: 2x25G, 4x25G, 1x100G and 2x100G, Expo Hall Booth C2.

Broadcom will also participate in numerous technical panel sessions at this years summit, specifically:

-- Networking and New Data Center Challenges- Presented by Meta, Ram Velaga, senior vice president and general manager, Broadcom will join Omar Baldanado, director of Engineering, Meta, on stage during the Meta keynote, Tuesday, November 9, 9:17a.m., SJCC- Concourse Level- Grand Ballroom 220. -- Dual TOR Use Case When Having Single-NIC Servers, Kamini Santhanagopalan, product line manager, and Lawrence Lee, software engineer, Microsoft, on Wednesday, November 10, 10:00a.m., SJCC LL20BC. -- Network Challenges and Solutions in PTP Hyperscale Data Centers, Amit Oren distinguished engineer, architecture and technology, Bhaskar Chinni, principal product line manager, and Ahmad Byagowi, hardware engineer, Meta, on Wednesday, November 10, 11:00a.m., SJCC 210AE. -- Hardware Project Management Update, Hemal Shah, distinguished engineer and architect, and Bob Stevens, distinguished member, Technical Staff, Dell, Wednesday, November 10, 1:00p.m., SJCC 210AE. -- Stateful and Stateless Monitoring Capabilities, Bhaskar Chinni, principal product line manager, and Rui Miao, network engineer, Alibaba, on Wednesday, November 10, 1:00p.m., SJCC LL20BC. -- OCP NIC 3.0 Management with NC-SI 1.2, Hemal Shah, distinguished engineer and architect, and Bob Stevens, distinguished member, Technical Staff, Dell, Wednesday, November 10, 2:00p.m., SJCC 210AE. -- SAI pipeline enhancements with Pre-Ingress ACL and MyMAC Station Stages and Enhanced FEC Modes for High Speed, 200G and Above Ports, Jai Kumar, distinguished engineer, architecture and technology, Kishore Gummadidala, software engineer, and Mike Beresford, software engineer, Google, Wednesday, November 10, 2:00p.m., SJCC LL20BC. -- SONiC Automation: Large Scale Deployments Made Easy, Kamran Naqvi, principal network architect, and Lumir Honus, lead principal network architect, AT&T, Wednesday, November 10, 4:00p.m., SJCC LL20BC. -- Migration to SONiC from 3-tiered Legacy Network EPFL Case Study, Kamran Naqvi, principal network architect, Eric Krejci, infrastructure architect, EPFL, and Mehdi Abdelouahab, product manager, Juniper Networks, Wednesday, November 10, 4:25p.m., SJCC LL20BC.

In addition, Broadcom has also extendedthe PHY Abstraction Interface (PAI) layer to enable line card PHYs, further demonstrating support of the broader OCP community. Like the Switch Abstraction Layer available for Broadcoms Ethernet switch products,PAI consists of standardized C based APIs to program the externalretimers, gearboxes and MACSec PHY devices. This open source API driver set makes the customer application level programs agnostic to the underlying silicon and easy to use.

For more information on Broadcom solutions supporting open source initiatives visit https://www.broadcom.com.

AboutBroadcomBroadcom Inc.(NASDAQ: AVGO)is a global technology leader thatdesigns, develops and supplies a broad range of semiconductor and infrastructure software solutions.Broadcoms category-leading product portfolio serves critical markets including data center, networking, enterprise software, broadband, wireless, storage and industrial.Our solutions includedata center networkingand storage, enterprise, mainframe and cyber security software focused on automation, monitoring and security, smartphone components, telecoms andfactory automation.For more information, go to https://www.broadcom.com.

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Press Contact:Jon PiazzaCorporate Communicationspress.relations@broadcom.comTelephone: +1 408 433 7924