Benzinga | Jun 16, 2021 10:40AM EDT

Applied Materials Introduces Chip Wiring Enabling Scaling To 3nm And Beyond

* Applied Materials Inc (NASDAQ:AMAT) showcased a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.

* Applied Materials developed a new materials engineering solution called the Endura Copper Barrier Seed IMS by combining seven different process technologies in one system under a high vacuum.

* It eliminated the high-resistivity barrier via the interface.

* The solution included copper reflow technology that enabled void-free gap fill in narrow features.

* It helped to reduce electrical resistance at the via contact interface by up to 50%.

* It improved chip performance and power consumption and enabled logic scaling to continue to 3nm and beyond.

* Price action: AMAT shares traded higher by 0.25% at $138.99 in the market session on the last check Wednesday.